STMicroelectronics David Renno: eSE merge NFC, eSIM, with TEE Secure Mobile Payment Solution

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Effie   2017/11/29

On November 15, the 2nd China Mobile Financial Security Conference 2017 was successfully held by Mobile Payment Network and Beijing Mobile Financial Industry in Shenzhen. David Renno, mobile security marketing manager at STMicroelectronics’ Secure Microcontroller Division, has shared “Trends in Security Applications of Mobile Devices.”

In his view, hardware-level security is necessary as mobile devices and personal banking, payment, and biometric information become more and more intimate.

David Renno said mobile devices currently need to protect more and more confidential information, such as the private key of a bank card, the passkey of a city pass card, the profile data of a mobile operator, biometric data for authentication, ect.

Most of the current market are using TEE + NFC + SE security architecture. After a long period of development, mobile payment solutions are now being promoted almost everywhere by mobile device manufacturers and local operators such as Apple and FeliCa, Samsung and Korean transit, as well as domestic Xiaomi Huawei and transport operators, ect.

David Renno thinks that for the rapid development of biometric technology, currently is to store biometric information and run it in the TEE environment, but in the future, with the increase of application and higher security level, eSE can also do a lot of fast Computing process, then chip-level protection based on eSE secure carrier is a more secure option.

In addition, David Renno mentioned the development of eSIM. The eSIM operating system can support multiple mobile operator file information configuration, support for remote activation operator configuration, and in line with the GSMA specification requirements, there are some global eSIM application practices currently. Such as Huawei Watch, TicWatch, Samsung Gear S2 / S3, iWatch and some other wearable devices, as well as Google’s Pixel 2 mobile phone, Apple’s iPad, etc.

He said the eSIM security requirements are very high, because it contains the user’s information and the operator’s key, while in other scenarios needs to pass the eSIM to complete the authentication. Therefore, he thinks, eSE is the perfect solution which integrate NFC, eSIM and TEE.

Finally, he mentioned the ST54 NFC + eSE / eSIM security chip, which is the latest ST solution that includes the NFC controller, eSE security chip and eSIM, and is composed of the ST21NFCD + ST33 eSE / eSIM. Among them, ST21 has more than 30 million shipments in 2017 and ST33 has nearly 700 million shipments in the third quater of 2017 including SWP-SIM, eSE, eSIM and others.

As the largest semiconductor company in Europe, STMicroelectronics has a broad market presence in all areas of communications, consumption, computing, automotive and industrial sectors worldwide with sales of nearly $ 7 billion in 2016.

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